Musk is building a complete microchip production and packaging chain in the USA, including PCB, FOPLP, and a future wafer fab capable of meeting the needs of Tesla, SpaceX, and Starlink.
Musk is creating his own versions of TSMC, LAM Research, and Tokyo Electron, tailored to his tasks and capable of operating autonomously in critical situations. This decision is logical, given the capacity constraints, supply problems, and Musk's unsuccessful attempt to gain priority from TSMC.
The initiative started with two facilities: a new PCB center in Texas is operational, and the FOPLP factory has begun installing equipment and plans limited production in the third quarter of 2026.
SpaceX aims to consolidate chip packaging for satellites, reduce costs, and fully control Starlink components. While production has not yet started, RF and power management chips from STMicro and Innolux are being used, but internal production will replace them by 2027.
In a year and a half, Musk's companies will begin to independently produce products according to their own designs and standards.
Plans also include a mega-factory for the production of 100,000 wafers, and in the future — 1,000,000 per month, capable of producing 14nm and smaller circuits. This will allow Tesla and SpaceX to bypass geopolitical restrictions and capacity shortages in Taiwan and South Korea. Musk has hired specialists from Intel, TSMC, and Samsung, fully focusing on chips.
