Good Luck Upgrading Your PC in 2026. Testing and Packaging of RAM Have Risen by 30%
Further growth is expected throughout the year.
The memory market continues to experience significant strain due to supply shortages, and now the wave of price increases has reached the processing segment. According to a recent UDN report, leading Taiwanese memory packaging and testing companies - Powertech Technology, Walton, and ChipMOS - have raised prices for their services by up to 30%.
These companies are engaged in the final packaging and testing of DRAM chips manufactured by major market players - Samsung, SK Hynix, and Micron. They package DRAM dies into finished modules (DDR4, DDR5, HBM, and others) and validate them before shipping to customers.
The sharp increase in demand is primarily driven by customers in the field of artificial intelligence (AI), who require huge amounts of high-performance memory, including HBM. This has led to an overload of packaging and testing capacities. According to sources in the supply chain, companies have already raised prices by 30%, and a second wave of increases is planned in the near future.
