Sony may ditch liquid metal in PlayStation 6 - new patent hints at a different cooling system

Liquid metal in the PS5 has been repeatedly criticized by experts.

Sony Interactive Entertainment, according to a recently published patent, is considering using a new cooling system in the PlayStation 6. If the technology is implemented in the final version of the console, it will replace the liquid metal used in the PlayStation 5.

The PS5's liquid metal-based cooling system has been repeatedly criticized since the console's release in 2020. Owners of early revisions reported device overheating, as well as cases of liquid metal leaking onto the APU and motherboard components, leading to serious malfunctions. Such reports continue to appear several years after the console's launch.

The new patent describes a liquid evaporation-based cooling system. Instead of liquid metal, it proposes using a cooling fluid (such as water) and several conical heat pipes that ensure the circulation of the coolant and efficient heat dissipation from the processor. In addition, such a design should maintain high efficiency regardless of whether the console is positioned horizontally or vertically.

Another advantage of the new technology could be reduced manufacturing costs. Applying liquid metal requires high precision during assembly, as even a small error can damage device components. An evaporation chamber, on the other hand, is a ready-made module that can be installed on the APU using standard manufacturing methods, reducing the likelihood of defects and simplifying the assembly process.

However, the appearance of a patent does not mean that this particular system will be used in the PlayStation 6.