Insider: Intel to get a major contract - NVIDIA ready to entrust it with Feynman chips

According to insider @bubbleboi, NVIDIA is preparing to sign the largest contract in history with Intel Foundry for the production and packaging of Feynman chips.

According to insider @bubbleboi on X, Intel Foundry is preparing to sign the largest contract in its history with NVIDIA. This involves the supply of silicon wafers and the packaging of new generation Feynman graphics chips. If the agreement is signed, NVIDIA will become Intel's largest and most profitable client.

Indirect confirmation comes from recent statements by Intel CEO Lip-Bu Tan. During the financial results report, he announced massive investments in chip packaging technologies, including eMIB, as well as the expansion of production capacities. The company's head noted that Intel has already secured large long-term contracts, allowing it to plan production years in advance.

Sources believe that NVIDIA's interest is due to TSMC's high utilization, which cannot meet the demand for AI chips. Intel offers available production capacities, lower costs, and product manufacturing in the USA.

The Feynman family is expected to launch in 2028 after the Rubin and Blackwell generations. The chips will feature Intel Foveros Direct3D three-dimensional packaging, a new HBM memory standard, and a Rosa auxiliary processor. For this, Intel is accelerating the preparation of the Intel 14A process for mass production. If the deal goes through, Intel Foundry's position in the market could significantly strengthen.